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Publication numberUSD345731 S
Publication typeGrant
Application numberUS 29/002,224
Publication dateApr 5, 1994
Filing dateDec 3, 1992
Publication number002224, 29002224, US D345731 S, US D345731S, US-S-D345731, USD345731 S, USD345731S
InventorsNorman L. Owens, Timothy L. Olson
Original AssigneeMotorola, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor package
US D345731 S
Abstract  available in
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  1. The ornamental design for a semiconductor package, as shown and described.

FIG. 1 is a front and upper right perspective view of a semiconductor package showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is a bottom plan view thereof.

Non-Patent Citations
1Mini-Circuits' YSW-2-50DR semiconductor package on p. 5 of EDN Jan. 1991.
U.S. ClassificationD13/182