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Publication numberUSD348391 S
Publication typeGrant
Application numberUS 29/005,419
Publication dateJul 5, 1994
Filing dateMar 4, 1993
Publication number005419, 29005419, US D348391 S, US D348391S, US-S-D348391, USD348391 S, USD348391S
InventorsToru Ichikawa, Yuko Wada, Yuko Suzuki, Ellen Tave, Rosalin Yin, Yoshie Nagasaka
Original AssigneeSony Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Package for a headphone
US D348391 S
Abstract  available in
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  1. The ornamental design for a package for a headphone, as shown.

FIG. 1 is a top, front and right-side perspective view of a package for a headphone, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side elevational view thereof;

FIG. 5 is a right-side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Non-Patent Citations
1Hardware Age, Sep. 1984, p. 60 as shown.
2Modern Packaging, 1978, p. 300, as shown.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6170663Oct 26, 1999Jan 9, 2001Sony CorporationClamshell package including three dimensional insert
US6227369Oct 29, 1999May 8, 2001Sony CorporationClamshell package including both permanent and resealable fastening structure
US6364114Feb 7, 2001Apr 2, 2002Sony CorporationClamshell package including both permanent and resealable fastening structure
US20130118944 *Nov 15, 2012May 16, 2013Mark T. NiiroPackaging for headphones, packaged headphones, and related methods
U.S. ClassificationD09/415