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Publication numberUSD355411 S
Publication typeGrant
Application numberUS 29/009,137
Publication dateFeb 14, 1995
Filing dateJun 4, 1993
Publication number009137, 29009137, US D355411 S, US D355411S, US-S-D355411, USD355411 S, USD355411S
InventorsAmir-Akbar Sadigh-Behzadi
Original AssigneeCicon Components, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Integrated circuit electronic package
US D355411 S
Images(4)
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Claims(1)
  1. The ornamental design for an integrated circuit electronic package, as shown and described.
Description

FIG. 1 is a left, front perspective view showing my new integrated circuit electronic package design as it is attached to an integrated circuit;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a right side elevational view thereof which is a mirror image of the left side elevational view.

Non-Patent Citations
Reference
1Data sheet for "Ansley 28-Position Low-Profile Prom Socket and Header Module", Thomas & Betts Corp., catalog, 1988, 6 pages.
2Data sheet for "Ansley Dip Sockets with Decoupling Capacitor", Thomas & Betts Corp. catalog, 1988, 2 pages.
Classifications
U.S. ClassificationD13/182