US D355411 S
Abstract available in
FIG. 1 is a left, front perspective view showing my new integrated circuit electronic package design as it is attached to an integrated circuit;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a right side elevational view thereof which is a mirror image of the left side elevational view.