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Publication numberUSD357227 S
Publication typeGrant
Application numberUS 29/013,459
Publication dateApr 11, 1995
Filing dateSep 24, 1993
Publication number013459, 29013459, US D357227 S, US D357227S, US-S-D357227, USD357227 S, USD357227S
InventorsMatthew C. Smithers
Original AssigneeThermalloy, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Spring clip for retaining thermal contact between an electronic device package and a heat sink
US D357227 S
Abstract  available in
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Claims(1)
  1. The ornamental design disclosed for a spring clip for retaining thermal contact between an electronic device package and a heat sink, as shown and described.
Description

FIG. 1 is a front perspective view of a spring clip for retaining thermal contact between an electronic device package and a heat sink showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a side elevational view thereof, the opposite side view being a mirror image of the view of FIG. 5; and,

FIG. 6 is a bottom plan view of my spring clip for retaining thermal contact between an electronic device package and a heat sink.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6496371Mar 30, 2001Dec 17, 2002Intel CorporationHeat sink mounting method and apparatus
US8526800 *Dec 18, 2009Sep 3, 2013Whirlpool CorporationGlass-ceramic cooktop and method of assembling the same
US8768152 *Jul 24, 2013Jul 1, 2014Whirlpool CorporationGlass-ceramic cooktop and method of assembling the same
US20110150439 *Dec 18, 2009Jun 23, 2011Whirlpool CorporationGlass-ceramic cooktop and method of assembling the same
Classifications
U.S. ClassificationD13/179, D08/395