Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSD358806 S
Publication typeGrant
Application numberUS 29/013,438
Publication dateMay 30, 1995
Filing dateSep 24, 1993
Publication number013438, 29013438, US D358806 S, US D358806S, US-S-D358806, USD358806 S, USD358806S
InventorsHarry M. Siegel, Michael J. Hundt, Krishnan Kelappan
Original AssigneeSgs-Thomson Microelectronics, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Socketed integrated circuit package
US D358806 S
Images(1)
Previous page
Next page
Claims(1)
  1. The ornamental design for the socketed integrated circuit package, as shown and described.
Description

FIG. 1 is a perspective view of the integrated circuit package;

FIG. 2 is a side elevation view of the integrated circuit package;

FIG. 3 is an end elevation view of the integrated circuit package from its end nearer the lockout key;

FIG. 4 is an end elevation view of the integrated circuit package from its end opposite that from the lockout key;

FIG. 5 is a top plan view of the integrated circuit package; and,

FIG. 6 is a bottom plan view of the integrated circuit package.

Classifications
U.S. ClassificationD13/182