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Publication numberUSD359028 S
Publication typeGrant
Application numberUS 29/012,499
Publication dateJun 6, 1995
Filing dateSep 2, 1993
Publication number012499, 29012499, US D359028 S, US D359028S, US-S-D359028, USD359028 S, USD359028S
InventorsHarry M. Siegel, Michael J. Hundt, Krishnan Kelappan
Original AssigneeSgs-Thomson Microelectronics, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Socketed integrated circuit package
US D359028 S
Abstract  available in
Images(1)
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Claims(1)
  1. The ornamental design for the socketed integrated circuit package, as shown and described.
Description

FIG. 1 is a perspective view of the integrated circuit package;

FIG. 2 is a side elevation view of the integrated circuit package;

FIG. 3 is an end elevation view of the integrated circuit package from its end nearer the lockout key;

FIG. 4 is an end elevation view of the integrated circuit package from its end opposite that from the lockout key;

FIG. 5 is a top plan view of the integrated circuit package; and,

FIG. 6 is a bottom plan view of the integrated circuit package.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD738834 *Jul 29, 2014Sep 15, 2015Jianhui XieDriver circuit integrated LED module
USD769834Oct 1, 2014Oct 25, 2016Mitsubishi Electric CorporationSemiconductor device
USD770994 *Jun 20, 2016Nov 8, 2016Mitsubishi Electric CorporationPower semiconductor device
USD772182 *Sep 29, 2014Nov 22, 2016Mitsubishi Electric CorporationPower semiconductor device
USD777124 *Jun 20, 2016Jan 24, 2017Mitsubishi Electric CorporationPower semiconductor device
USD783550 *Jun 20, 2016Apr 11, 2017Mitsubishi Electric CorporationPower semiconductor device
USD788722 *Nov 24, 2014Jun 6, 2017Advantest CorporationSocket for an electronic device testing apparatus
Classifications
U.S. ClassificationD13/182