Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD368903 S
Publication typeGrant
Application numberUS 29/036,254
Publication dateApr 16, 1996
Filing dateMar 16, 1995
Priority dateJun 30, 1994
Publication number036254, 29036254, US D368903 S, US D368903S, US-S-D368903, USD368903 S, USD368903S
InventorsJun Ohmori, Hiroshi Iwasaki
Original AssigneeKabushiki Kaisha Toshiba
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
IC module
US D368903 S
Abstract  available in
Previous page
Next page
  1. The ornamental design for an IC module, as shown and described.

FIG. 1 is a perspective view of the front, bottom and right side elevational view of an IC module, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof, the bottom plan view is identical; and,

FIG. 6 is a rear elevational view thereof.

Non-Patent Citations
1Official Gazette, design patent D328599, p. 1377, Aug. 11, 1992.
2Official Gazette, design patent D331922, p. 2439, Dec. 22, 1992.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7549244Nov 5, 2007Jun 23, 2009Discover Financial Services LlcCredit card with reduced points of contact
US7656014Jul 18, 2007Feb 2, 2010Renesas Technology Corp.Semiconductor device and method for manufacturing same
US20060091568 *Oct 25, 2005May 4, 2006Renesas Technology Corp.Semiconductor device and method for manufacturing same
US20070257346 *Jul 18, 2007Nov 8, 2007Yoshiyuki TanigawaSemiconductor device and method for manufacturing same
U.S. ClassificationD14/437