US D368903 S
Abstract available in
FIG. 1 is a perspective view of the front, bottom and right side elevational view of an IC module, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof, the bottom plan view is identical; and,
FIG. 6 is a rear elevational view thereof.