|Publication number||USD373566 S|
|Application number||US 29/040,944|
|Publication date||Sep 10, 1996|
|Filing date||Jun 30, 1995|
|Publication number||040944, 29040944, US D373566 S, US D373566S, US-S-D373566, USD373566 S, USD373566S|
|Inventors||Roman P. Rak, William E. Fenton|
|Original Assignee||Motorola, Inc.|
|Export Citation||BiBTeX, EndNote, RefMan|
|External Links: USPTO, USPTO Assignment, Espacenet|
FIG. 1 is a perspective view showing a top, right, and front side of a preferred embodiment of our new design for an overmold for an interface cable in accordance with the present invention;
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a perspective view showing the top, right, and front side of an alternative embodiment of our design in accordance with the instant invention.
The broken line showing throughout the drawing Figures is included for the purpose of illustrating environmental structure only and forms no part of the claimed design.