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Publication numberUSD381668 S
Publication typeGrant
Application numberUS 29/056,175
Publication dateJul 29, 1997
Filing dateJun 25, 1996
Publication number056175, 29056175, US D381668 S, US D381668S, US-S-D381668, USD381668 S, USD381668S
InventorsJohn N. Boucher, David E. Bajune
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor wafer dicing saw
US D381668 S
Abstract  available in
Images(2)
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Claims(1)
  1. The ornamental design for a semiconductor wafer dicing saw, as shown and described.
Description

FIG. 1 is a top, left front perspective view of a semiconductor wafer dicing saw showing our new design;

FIG. 2 is a right side elevational view thereof, the left side view being a mirror image;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a top, left perspective view of a second embodiment of FIG. 1, the difference being inclusion of a camera, blade housing and chuck;

FIG. 7 is a top plan view of FIG. 6;

FIG. 8 is a right side elevational view of FIG. 6;

FIG. 9 is a left side elevational view of FIG. 6;

FIG. 10 is a bottom plan view of FIG. 6; and,

FIG. 11 is a rear elevational view of FIG. 6.

The broken line showing of camera, blade housing and chuck in FIGS. 1-3 and 5 is for illustrative purposes only and forms no part on the claimed design for the embodiment of FIGS. 1-5.

Classifications
U.S. ClassificationD15/133, D15/127