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Publication numberUSD387364 S
Publication typeGrant
Application numberUS 29/056,194
Publication dateDec 9, 1997
Filing dateJun 25, 1996
Publication number056194, 29056194, US D387364 S, US D387364S, US-S-D387364, USD387364 S, USD387364S
InventorsJohn N. Boucher, David E. Bajune
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor wafer dicing saw
US D387364 S
Images(3)
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Claims(1)
  1. The ornamental design for a semiconductor wafer dicing saw, as shown and described.
Description

FIG. 1 is a top, left front perspective view of a semiconductor wafer dicing saw showing our new design;

FIG. 2 is a right side elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a rear elevational view thereof;

FIG. 7 is a top, left perspective view of a second embodiment of FIG. 1, the difference being inclusion of coolant controls, camera, blade housing and chuck;

FIG. 8 is a right side elevational view of FIG. 7;

FIG. 9 is a left side elevational view of FIG. 7;

FIG. 10 is a top plan view of FIG. 7;

FIG. 11 is a bottom plan view of FIG. 7; and,

FIG. 12 is a rear elevational view of FIG. 7.

The broken line showing of keyboard keys, coolant controls, camera, blade housing and chuck in FIGS. 1-4 and 6 is for illustrative purposes only and forms no part on the claimed design for the embodiment of FIGS. 1-6.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6319354Oct 20, 2000Nov 20, 2001Micron Technology, Inc.System and method for dicing semiconductor components
Classifications
U.S. ClassificationD15/133, D15/127