US D387747 S
Abstract available in
FIG. 1 is a front, bottom and right side perspective view of an IC module, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof, the opposite side being a mirror image;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a rear elevational view thereof.