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Publication numberUSD395423 S
Publication typeGrant
Application numberUS 29/068,117
Publication dateJun 23, 1998
Filing dateMar 13, 1997
Publication number068117, 29068117, US D395423 S, US D395423S, US-S-D395423, USD395423 S, USD395423S
InventorsMichio Koyama, Yukinobu Wataya
Original AssigneeSony Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor package
US D395423 S
Abstract  available in
Images(8)
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Claims(1)
  1. The ornamental design for a semiconductor package, as shown and described.
Description

FIG. 1 is a perspective view of a first embodiment of a semiconductor package showing our new design;

FIG. 2 is a left side elevational view thereof, top plan, bottom plan and right side elevational views are the same image;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a perspective view of a second embodiment of a semiconductor package showing our new design;

FIG. 6 is a top plan view of the embodiment of FIG. 5;

FIG. 7 is a left side elevational view of the embodiment of FIG. 5;

FIG. 8 is a front elevational view of the embodiment of FIG. 5;

FIG. 9 is a bottom plan view of the embodiment of FIG. 5;

FIG. 10 is a right side elevational view of the embodiment of FIG. 5;

FIG. 11 is a rear elevational view of the embodiment of FIG. 5;

FIG. 12 is a perspective view of a third embodiment of a semiconductor package showing our new design;

FIG. 13 is a top plan view of the embodiment of FIG. 12;

FIG. 14 is a left side elevational view of the embodiment of FIG. 12;

FIG. 15 is a front elevational view of the embodiment of FIG. 12;

FIG. 16 is a bottom plan view of the embodiment of FIG. 12;

FIG. 17 is a right side elevational view of the embodiment of FIG. 12; and,

FIG. 18 is a rear elevational view of the embodiment of FIG. 12.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD738834 *Jul 29, 2014Sep 15, 2015Jianhui XieDriver circuit integrated LED module
Classifications
U.S. ClassificationD13/182