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Publication numberUSD400169 S
Publication typeGrant
Application numberUS 29/052,196
Publication dateOct 27, 1998
Filing dateMar 26, 1996
Priority dateSep 27, 1995
Publication number052196, 29052196, US D400169 S, US D400169S, US-S-D400169, USD400169 S, USD400169S
InventorsSyuuei Endo
Original AssigneeSony Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Leading wire
US D400169 S
Abstract  available in
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  1. The ornamental design for a leading wire, as shown and described.

FIG. 1 is a perspective view of a leading wire showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof, the left side elevational view being a mirror image;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a rear elevational view thereof.

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US20060148276 *Jan 15, 2004Jul 6, 2006Jean-Pierre RenaudinElectrical connection device for bushing which supplies filaments, such as glass filaments
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US20090282888 *Nov 19, 2009Embarq Holdings Company, Llc.System and method for creating a ground bonding strap
U.S. ClassificationD13/120, D13/153