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Publication numberUSD400169 S
Publication typeGrant
Application numberUS 29/052,196
Publication dateOct 27, 1998
Filing dateMar 26, 1996
Priority dateSep 27, 1995
Publication number052196, 29052196, US D400169 S, US D400169S, US-S-D400169, USD400169 S, USD400169S
InventorsSyuuei Endo
Original AssigneeSony Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Leading wire
US D400169 S
Abstract  available in
Images(2)
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Claims(1)
  1. The ornamental design for a leading wire, as shown and described.
Description

FIG. 1 is a perspective view of a leading wire showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof, the left side elevational view being a mirror image;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a rear elevational view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7232348 *Jan 15, 2004Jun 19, 2007Saint-Gobain Vetrotex France S.A.Electrical connection device for bushing which supplies filaments, such as glass filaments
US7591696 *May 19, 2008Sep 22, 2009Embarq Holdings Company, LlcGround bonding strap
US7787739Aug 31, 2010Embarq Holdings Company, LlcBare fiber adapter
US8453486Mar 24, 2009Jun 4, 2013Centurylink Intellectual Property LlcSystem and method for creating a ground bonding strap
US8770007May 6, 2013Jul 8, 2014Centurylink Intellectual Property LlcStamp for ground bonding strap
US9352374May 27, 2014May 31, 2016Centurylink Intellectual Property LlcMethod for assembling stamp for ground bonding strap
US20060148276 *Jan 15, 2004Jul 6, 2006Jean-Pierre RenaudinElectrical connection device for bushing which supplies filaments, such as glass filaments
US20090058941 *Aug 29, 2008Mar 5, 2009Applied Materials, Inc.Methods and apparatus for modular print head and adapter and rotation thereof with inkjet printer systems
US20090060418 *Sep 27, 2007Mar 5, 2009Embarq Holdings Company, LlcBare fiber adapter
US20090282888 *Nov 19, 2009Embarq Holdings Company, Llc.System and method for creating a ground bonding strap
Classifications
U.S. ClassificationD13/120, D13/153