Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSD402638 S
Publication typeGrant
Application numberUS 29/070,029
Publication dateDec 15, 1998
Filing dateApr 25, 1997
Publication number070029, 29070029, US D402638 S, US D402638S, US-S-D402638, USD402638 S, USD402638S
InventorsWarren M. Farnworth, Alan G. Wood, David R. Hembree, Salman Akram
Original AssigneeMicron Technology, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Temporary package for semiconductor dice
US D402638 S
Images(2)
Previous page
Next page
Claims(1)
  1. The ornamental design for a temporary package for semiconductor dice, as shown and described.
Description

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing our new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.

Non-Patent Citations
Reference
11994 DRAM Data Book, Micron Semiconductor, Inc., pp. 7-7 - 7-13, Apr., 1994.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6222379Jun 8, 1998Apr 24, 2001Micron Technology, Inc.Conventionally sized temporary package for testing semiconductor dice
US6558600May 4, 2000May 6, 2003Micron Technology, Inc.Method for packaging microelectronic substrates
US6564979Jul 18, 2001May 20, 2003Micron Technology, Inc.Method and apparatus for dispensing adhesive on microelectronic substrate supports
US6576494Jun 28, 2000Jun 10, 2003Micron Technology, Inc.Recessed encapsulated microelectronic devices and methods for formation
US6638595Jul 11, 2001Oct 28, 2003Micron Technology, Inc.Method and apparatus for reduced flash encapsulation of microelectronic devices
US6644949Jul 11, 2001Nov 11, 2003Micron Technology, Inc.Apparatus for reduced flash encapsulation of microelectronic devices
US6653173Sep 19, 2001Nov 25, 2003Micron Technology, Inc.Method and apparatus for packaging a microelectronic die
US6656769May 8, 2001Dec 2, 2003Micron Technology, Inc.Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
US6664139Sep 19, 2001Dec 16, 2003Micron Technology, Inc.Method and apparatus for packaging a microelectronic die
US6677675Sep 19, 2001Jan 13, 2004Micron Technology, Inc.Microelectronic devices and microelectronic die packages
US6683388Sep 19, 2001Jan 27, 2004Micron Technology, Inc.Method and apparatus for packaging a microelectronic die
US6740546Aug 21, 2002May 25, 2004Micron Technology, Inc.Packaged microelectronic devices and methods for assembling microelectronic devices
US6781066Aug 29, 2002Aug 24, 2004Micron Technology, Inc.Packaged microelectronic component assemblies
US6796028Oct 7, 2002Sep 28, 2004Micron Technology, Inc.Method of Interconnecting substrates for electrical coupling of microelectronic components
US6819003Dec 16, 2002Nov 16, 2004Micron Technology Inc.Recessed encapsulated microelectronic devices and methods for formation
US6836009Aug 28, 2002Dec 28, 2004Micron Technology, Inc.Packaged microelectronic components
US6838760Aug 28, 2000Jan 4, 2005Micron Technology, Inc.Packaged microelectronic devices with interconnecting units
US6841423Dec 16, 2002Jan 11, 2005Micron Technology, Inc.Methods for formation of recessed encapsulated microelectronic devices
US6876066Aug 30, 2001Apr 5, 2005Micron Technology, Inc.Packaged microelectronic devices and methods of forming same
US6879050Feb 11, 2003Apr 12, 2005Micron Technology, Inc.Packaged microelectronic devices and methods for packaging microelectronic devices
US6921860Mar 18, 2003Jul 26, 2005Micron Technology, Inc.Packages for electrical and electronic apparatus such as flip chips comprising a layout of spaced dams associated with and enclosing terminals, and dielectric coverings; miniaturization
US6924550Apr 5, 2004Aug 2, 2005Micron Technology, Inc.comprises die and an interposer substrate which includes depositing solder ball onto a ball-pad on the interposer substrate and molding to form casing; integrated circuits
US6933170Apr 5, 2004Aug 23, 2005Micron Technology, Inc.Packaged microelectronic component assemblies
US6943450Aug 30, 2004Sep 13, 2005Micron Technology, Inc.Packaged microelectronic devices and methods of forming same
US6951982Dec 18, 2002Oct 4, 2005Micron Technology, Inc.Packaged microelectronic component assemblies
US6979595Aug 24, 2000Dec 27, 2005Micron Technology, Inc.Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US6982386Oct 7, 2002Jan 3, 2006Micron Technology, Inc.Interconnecting substrates for electrical coupling of microelectronic components
US6983551Oct 7, 2002Jan 10, 2006Micron Technology, Inc.Interconnecting substrates for electrical coupling of microelectronic components
US7057273Jun 29, 2001Jun 6, 2006Gem Services, Inc.Surface mount package
US7057281Apr 28, 2003Jun 6, 2006Micron Technology Inc.Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US7067905Aug 8, 2002Jun 27, 2006Micron Technology, Inc.Packaged microelectronic devices including first and second casings
US7091064Aug 24, 2004Aug 15, 2006Micron Technology, Inc.Method and apparatus for attaching microelectronic substrates and support members
US7101737Oct 20, 2004Sep 5, 2006Micron Technology, Inc.Method of encapsulating interconnecting units in packaged microelectronic devices
US7109588Apr 4, 2002Sep 19, 2006Micron Technology, Inc.Method and apparatus for attaching microelectronic substrates and support members
US7157310Sep 1, 2004Jan 2, 2007Micron Technology, Inc.Methods for packaging microfeature devices and microfeature devices formed by such methods
US7195957Aug 19, 2004Mar 27, 2007Micron Technology, Inc.Packaged microelectronic components
US7218001Apr 5, 2004May 15, 2007Micron Technology, Inc.Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
US7259451Aug 15, 2005Aug 21, 2007Micron Technology, Inc.Invertible microfeature device packages
US7273769Aug 16, 2000Sep 25, 2007Micron Technology, Inc.Method and apparatus for removing encapsulating material from a packaged microelectronic device
US7306974Aug 16, 2005Dec 11, 2007Micron Technology, Inc.Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies
US7332376Sep 5, 2006Feb 19, 2008Micron Technology, Inc.Method of encapsulating packaged microelectronic devices with a barrier
US7365424May 18, 2006Apr 29, 2008Micron Technology, Inc.Microelectronic component assemblies with recessed wire bonds and methods of making same
US7368810Aug 29, 2003May 6, 2008Micron Technology, Inc.Invertible microfeature device packages
US7405487Aug 12, 2002Jul 29, 2008Micron Technology, Inc.Method and apparatus for removing encapsulating material from a packaged microelectronic device
US7425470Aug 17, 2004Sep 16, 2008Micron Technology, Inc.Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US7579684May 9, 2006Aug 25, 2009Micron Technology, Inc.Methods for packing microfeature devices and microfeature devices formed by such methods
US7615871Jun 30, 2006Nov 10, 2009Micron Technology, Inc.Method and apparatus for attaching microelectronic substrates and support members
US7671459May 1, 2006Mar 2, 2010Micron Technologies, Inc.Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US7691680Apr 23, 2008Apr 6, 2010Micron Technologies, Inc.Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US7691726May 15, 2007Apr 6, 2010Micron Technology, Inc.Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
US7696003Mar 12, 2008Apr 13, 2010Micron Technology, Inc.Microelectronic component assemblies with recessed wire bonds and methods of making same
US7745944Aug 31, 2005Jun 29, 2010Micron Technology, Inc.Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
US7807505Aug 30, 2005Oct 5, 2010Micron Technology, Inc.Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US7833456Feb 23, 2007Nov 16, 2010Micron Technology, Inc.Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US7910385May 12, 2006Mar 22, 2011Micron Technology, Inc.Method of fabricating microelectronic devices
US7955898Mar 13, 2007Jun 7, 2011Micron Technology, Inc.Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US8138613Mar 21, 2011Mar 20, 2012Micron Technology, Inc.Microelectronic devices
US8202754Jun 13, 2006Jun 19, 2012Micron Technology, Inc.Packaged microelectronic devices recessed in support member cavities, and associated methods
US8203213Jun 29, 2010Jun 19, 2012Micron Technology, Inc.Methods for packaging microelectronic devices and microelectronic devices formed using such methods
US8319332May 18, 2010Nov 27, 2012Micron Technology, Inc.Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
US8441132Feb 17, 2012May 14, 2013Micron Technology, Inc.Packaged microelectronic devices recessed in support member cavities, and associated methods
US8450839Jan 19, 2010May 28, 2013Micron Technology, Inc.Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US8637973Mar 27, 2007Jan 28, 2014Micron Technology, Inc.Packaged microelectronic components with terminals exposed through encapsulant
US8703599Nov 27, 2012Apr 22, 2014Micron Technology, Inc.Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
Classifications
U.S. ClassificationD13/182