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Publication numberUSD402965 S
Publication typeGrant
Application numberUS 29/080,625
Publication dateDec 22, 1998
Filing dateDec 11, 1997
Publication number080625, 29080625, US D402965 S, US D402965S, US-S-D402965, USD402965 S, USD402965S
InventorsWerner Bender
Original AssigneePilz Gmbh & Co.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Modular housing for electrical circuits
US D402965 S
Abstract  available in
Images(5)
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Claims(1)
  1. The ornamental design for a modular housing for electrical circuits, as shown and described.
Description

FIG. 1 is a front perspective view of the modular housing for electrical circuits;

FIG. 2 is a rear perspective view of the unit of FIG. 1;

FIG. 3 is a front view of the unit of FIG. 1;

FIG. 4 is a top view of the unit of FIG. 1;

FIG. 5 is a left side view of the unit of FIG. 1;

FIG. 6 is a right side view of the unit of FIG. 1;

FIG. 7 is a bottom view of the unit of FIG. 1; and,

FIG. 8 is a rear view of the unit of FIG. 1.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6452789 *Apr 29, 2000Sep 17, 2002Hewlett-Packard CompanyPackaging architecture for 32 processor server
Classifications
U.S. ClassificationD13/162