US D404368 S
FIG. 1 a perspective view of a outertube for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a top plan view thereof;
FIG. 4 a bottom plan view thereof; and,
FIG. 5 a cross-sectional view taken along line V-V in FIG. 3 .