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Publication numberUSD404369 S
Publication typeGrant
Application numberUS 29/082,981
Publication dateJan 19, 1999
Filing dateFeb 2, 1998
Priority dateAug 20, 1997
Publication number082981, 29082981, US D404369 S, US D404369S, US-S-D404369, USD404369 S, USD404369S
InventorsSatoshi Kawachi
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Manifold cover for use in a semiconductor wafer heat processing apparatus
US D404369 S
Abstract  available in
Images(2)
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Claims(1)
  1. I claim the ornamental design for a manifold cover for use in a semiconductor wafer heat processing apparatus, as shown and described.
Description

FIG. 1 a perspective view of a cover manifold cover for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a rear elevational view thereof;

FIG. 4 a top plan view thereof;

FIG. 5 a bottom plan view thereof;

FIG. 6 a right side view thereof;

FIG. 7 a left side view thereof; and,

FIG. 8 a cross-sectional view taken along line VIII-VIII in FIG. 2.

Classifications
U.S. ClassificationD13/182