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Publication numberUSD404370 S
Publication typeGrant
Application numberUS 29/083,424
Publication dateJan 19, 1999
Filing dateFeb 5, 1998
Priority dateAug 20, 1997
Publication number083424, 29083424, US D404370 S, US D404370S, US-S-D404370, USD404370 S, USD404370S
InventorsNorifumi Kimura
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Cap for use in a semiconductor wafer heat processing apparatus
US D404370 S
Abstract  available in
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  1. I claim the ornamental design for cap for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1 a perspective view of a cap for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a top plan view thereof;

FIG. 3 a bottom plan view thereof;

FIG. 4 a front elevational view thereof; and,

FIG. 5 a cross-sectional view taken along line V--V in FIG. 2;

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US8394229Aug 7, 2008Mar 12, 2013Asm America, Inc.Susceptor ring
US20100031884 *Aug 7, 2008Feb 11, 2010Asm America, Inc.Susceptor ring
USD741823 *Jan 9, 2014Oct 27, 2015Hitachi Kokusai Electric Inc.Vaporizer for substrate processing apparatus
USD770992 *Oct 30, 2015Nov 8, 2016Hitachi High-Technologies CorporationElectrode cover for a plasma processing apparatus
USD797691 *Apr 14, 2016Sep 19, 2017Applied Materials, Inc.Composite edge ring
USD802790 *Oct 30, 2015Nov 14, 2017Hitachi High-Technologies CorporationCover ring for a plasma processing apparatus
U.S. ClassificationD13/182