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Publication numberUSD404372 S
Publication typeGrant
Application numberUS 29/083,715
Publication dateJan 19, 1999
Filing dateFeb 12, 1998
Priority dateAug 20, 1997
Publication number083715, 29083715, US D404372 S, US D404372S, US-S-D404372, USD404372 S, USD404372S
InventorsKatsutoshi Ishii
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Ring for use in a semiconductor wafer heat processing apparatus
US D404372 S
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  1. I claim the ornamental design for a ring for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1 a perspective view of a ring for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a top plan view thereof;

FIG. 3 a front elevational view thereof;

FIG. 4 a bottom plan view thereof;

FIG. 5 a right side view thereof;

FIG. 6 a rear elevational view thereof; and,

FIG. 7 a cross-sectional view taken along line VII--VII in FIG. 3.

U.S. ClassificationD13/182