Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSD405427 S
Publication typeGrant
Application numberUS 29/074,278
Publication dateFeb 9, 1999
Filing dateJul 24, 1997
Priority dateJan 31, 1997
Publication number074278, 29074278, US D405427 S, US D405427S, US-S-D405427, USD405427 S, USD405427S
InventorsKatsutoshi Ishii
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat retaining tube for use in a semiconductor wafer heat processing apparatus
US D405427 S
Abstract  available in
Images(2)
Previous page
Next page
Claims(1)
  1. I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described.
Description

FIG. 1: a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2: a top plan view thereof;

FIG. 3: a front elevational view thereof, the rear elevational view is identical with the front view;

FIG. 4: a right side view thereof, the left side view being a mirror image of the right view;

FIG. 5: a bottom plan view thereof; and,

FIG. 6: a cross sectional view thereof taken along line VI--VI in FIG. 3.

Classifications
U.S. ClassificationD13/182