US D405430 S
Abstract available in
FIG. 1: a perspective view of a inner tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2: a front elevational view thereof, the rear elevational view, the right side view and the left side view are identical with the front view;
FIG. 3: a top plan view thereof;
FIG. 4: a bottom plan view thereof; and,
FIG. 5: a cross sectional view thereof taken along line V-V in FIG. 3.