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Publication numberUSD405431 S
Publication typeGrant
Application numberUS 29/083,423
Publication dateFeb 9, 1999
Filing dateFeb 5, 1998
Priority dateAug 20, 1997
Publication number083423, 29083423, US D405431 S, US D405431S, US-S-D405431, USD405431 S, USD405431S
InventorsTomohisa Shimazu
Original AssigneeTokyo Electron Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Tube for use in a semiconductor wafer heat processing apparatus
US D405431 S
Images(5)
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Claims(1)
  1. I claim the ornamental design for tube for use in a semiconductor wafer heat processing apparatus, as shown and described.
Description

FIG. 1 a perspective view of a tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a cross-sectional view taken along line III--III in FIG. 2;

FIG. 4 a bottom plan view thereof;

FIG. 5 a right side view thereof;

FIG. 6 a rear elevational view thereof;

FIG. 7 a top plan view thereof;

FIG. 8 a cross-sectional view taken along line VIII--VIII in FIG. 7; and,

FIG. 9 a left side view thereof.

Classifications
U.S. ClassificationD13/182