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Publication numberUSD406113 S
Publication typeGrant
Application numberUS 29/074,293
Publication dateFeb 23, 1999
Filing dateJul 24, 1997
Priority dateJan 31, 1997
Publication number074293, 29074293, US D406113 S, US D406113S, US-S-D406113, USD406113 S, USD406113S
InventorsTetsuya Hanagata, Shingo Watanabe
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Processing tube for use in a semiconductor wafer heat processing apparatus
US D406113 S
Images(5)
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Claims(1)
  1. I claim the ornamental design for processing tube for use in a semiconductor wafer heat processing apparatus, as shown and described.
Description

FIG. 1 a perspective view of a processing tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a top plan view thereof;

FIG. 4 a bottom plan view thereof;

FIG. 5 a cross sectional view thereof taken along line V--V in FIG. 2;

FIG. 6 a rear elevational view thereof;

FIG. 7 a left side view thereof;

FIG. 8 a right side view thereof;

FIG. 9 a cross sectional view thereof taken along line IX--IX in FIG. 3; and,

FIG. 10 a cross sectional view thereof taken along line X--X in FIG. 3.

Classifications
U.S. ClassificationD13/182