|Publication number||USD411176 S|
|Application number||US 29/083,421|
|Publication date||Jun 22, 1999|
|Filing date||Feb 5, 1998|
|Priority date||Aug 20, 1997|
|Publication number||083421, 29083421, US D411176 S, US D411176S, US-S-D411176, USD411176 S, USD411176S|
|Original Assignee||Tokyo Electron Limited|
|Export Citation||BiBTeX, EndNote, RefMan|
|Referenced by (22), Classifications (1)|
|External Links: USPTO, USPTO Assignment, Espacenet|
FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus.
FIG. 2 a front elevational view thereof.
FIG. 3 a cross-sectional view taken along line III--III in FIG. 2.
FIG. 4 a cross-sectional view taken along line IV--IV in FIG. 2.
FIG. 5 a rear elevational view thereof.
FIG. 6 a right side view thereof.
FIG. 7 a top plan view thereof; and,
FIG. 8 a bottom plan view thereof.
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