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Publication numberUSD411176 S
Publication typeGrant
Application numberUS 29/083,421
Publication dateJun 22, 1999
Filing dateFeb 5, 1998
Priority dateAug 20, 1997
Publication number083421, 29083421, US D411176 S, US D411176S, US-S-D411176, USD411176 S, USD411176S
InventorsTomohisa Shimazu
Original AssigneeTokyo Electron Limited
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Wafer boat for use in a semiconductor wafer heat processing apparatus
US D411176 S
Abstract  available in
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  1. I claim the ornamental design for wafer boat for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1 a perspective view of a wafer boat for use in a semiconductor wafer heat processing apparatus.

FIG. 2 a front elevational view thereof.

FIG. 3 a cross-sectional view taken along line III--III in FIG. 2.

FIG. 4 a cross-sectional view taken along line IV--IV in FIG. 2.

FIG. 5 a rear elevational view thereof.

FIG. 6 a right side view thereof.

FIG. 7 a top plan view thereof; and,

FIG. 8 a bottom plan view thereof.

Referenced by
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US6196211 *Apr 15, 1999Mar 6, 2001Integrated Materials, Inc.Support members for wafer processing fixtures
US6205993Apr 15, 1999Mar 27, 2001Integrated Materials, Inc.Method and apparatus for fabricating elongate crystalline members
US6225594Apr 15, 1999May 1, 2001Integrated Materials, Inc.Method and apparatus for securing components of wafer processing fixtures
US6357432Jan 29, 2001Mar 19, 2002Integrated Materials, Inc.Silicon support members for wafer processing fixtures
US6450346Jun 30, 2000Sep 17, 2002Integrated Materials, Inc.Silicon fixtures for supporting wafers during thermal processing
US6455395Jun 30, 2000Sep 24, 2002Integrated Materials, Inc.Method of fabricating silicon structures including fixtures for supporting wafers
US6617225Aug 22, 2002Sep 9, 2003Integrated Materials, Inc.Method of machining silicon
US6617540Feb 23, 2001Sep 9, 2003Integrated Materials, Inc.Wafer support fixture composed of silicon
US7137546 *Aug 15, 2003Nov 21, 2006Integrated Materials, Inc.Silicon tube formed of bonded staves
US7498062May 26, 2004Mar 3, 2009Wd Media, Inc.Initiation of electroless plating is enhanced by applying a "strike voltage" to the substrates which are moved in a planetary manner while being held at their exterior edges by a set of parallel mandrels, one of which is connected to a power source
US7758732Feb 13, 2009Jul 20, 2010Wd Media, Inc.Method and apparatus for applying a voltage to a substrate during plating
US7854974Sep 18, 2006Dec 21, 2010Integrated Materials, Inc.Tube formed of bonded silicon staves
US8267831May 19, 2009Sep 18, 2012Western Digital Technologies, Inc.Method and apparatus for washing, etching, rinsing, and plating substrates
U.S. ClassificationD13/182