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Publication numberUSD412493 S
Publication typeGrant
Application numberUS 29/080,599
Publication dateAug 3, 1999
Filing dateOct 1, 1997
Priority dateJun 10, 1997
Publication number080599, 29080599, US D412493 S, US D412493S, US-S-D412493, USD412493 S, USD412493S
InventorsFumihiko Hikita
Original AssigneeKyoshin Kogyo Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Tape mounted heatsink package for electronic parts
US D412493 S
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for a tape mounted heatsink package for electronic parts, as shown and described.
Description

FIG. 1 is a top plan view of a tape mounted heatsink package for electronic parts showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof, the right side elevational view being mirror image;

FIG. 6 is a sectional view thereof, taken along line 6--6 in FIG. 2; and,

FIG. 7 is a top, front, and left side perspective view thereof, showing a pair of the heatsinks detached from the tape strip and mounted on an electronic circuit board assembly shown in broken-lines to indicate that it is not intended to form part of the claimed design.

The claimed designed is shown broken-away in the views to indicate indeterminate length, it being understood that the heat sink elements are continuous throughout the entire length of the packaging.

Classifications
U.S. ClassificationD13/179