US D412493 S
Abstract available in
FIG. 1 is a top plan view of a tape mounted heatsink package for electronic parts showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof, the right side elevational view being mirror image;
FIG. 6 is a sectional view thereof, taken along line 6--6 in FIG. 2; and,
FIG. 7 is a top, front, and left side perspective view thereof, showing a pair of the heatsinks detached from the tape strip and mounted on an electronic circuit board assembly shown in broken-lines to indicate that it is not intended to form part of the claimed design.
The claimed designed is shown broken-away in the views to indicate indeterminate length, it being understood that the heat sink elements are continuous throughout the entire length of the packaging.