Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD413315 S
Publication typeGrant
Application numberUS 29/081,114
Publication dateAug 31, 1999
Filing dateDec 22, 1997
Publication number081114, 29081114, US D413315 S, US D413315S, US-S-D413315, USD413315 S, USD413315S
InventorsThomas S. Klinker
Original AssigneeIntel Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Processor package cover plate for an integrated circuit processor package chipset
US D413315 S
Abstract  available in
Previous page
Next page
  1. The ornamental design for a processor package cover plate for an integrated circuit processor package chipset, as shown and described.

FIG. 1 is a perspective view of a cover plate on a processor package including an indented area on a surface of the cover plate.

FIG. 2 is a front view thereof.

FIG. 3 is a top view thereof.

FIG. 4 is a back view thereof.

FIG. 5 is a right side view thereof.

FIG. 6 is a left side view thereof.

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a cross-sectional view thereof, taken on line 8--8 of FIG. 2.

The broken line drawing in FIGS. 1, 3, and 5-8 of the processor package is for illustrative purposes only and forms no part of the claimed design.

U.S. ClassificationD14/432