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Publication numberUSD419979 S
Publication typeGrant
Application numberUS 29/098,376
Publication dateFeb 1, 2000
Filing dateDec 28, 1998
Priority dateOct 9, 1998
Publication number098376, 29098376, US D419979 S, US D419979S, US-S-D419979, USD419979 S, USD419979S
InventorsChun-Hsin Lu, Pao-Lung Lin, Nien-Tien Cheng
Original AssigneeHon Hai Precision Ind. Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Computer cooling device
US D419979 S
Abstract  available in
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  1. The ornamental design for a computer cooling device, as shown.

FIG. 1 is a front-right-top perspective view of a computer cooling device showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6817405 *Jun 3, 2002Nov 16, 2004International Business Machines CorporationApparatus having forced fluid cooling and pin-fin heat sink
US7131487 *Dec 14, 2001Nov 7, 2006Intel CorporationUse of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
U.S. ClassificationD14/439