US D420983 S
FIG. 1 is a perspective view of a semiconductor power package with three leads showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevational view thereof, the left side elevational view being a mirror image;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a rear elevational view thereof; and,
FIG. 6 is a front elevational view thereof.