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Publication numberUSD420983 S
Publication typeGrant
Application numberUS 29/095,110
Publication dateFeb 22, 2000
Filing dateOct 16, 1998
Publication number095110, 29095110, US D420983 S, US D420983S, US-S-D420983, USD420983 S, USD420983S
InventorsKangRim Choi
Original AssigneeIxys Corporation
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor power package with three leads
US D420983 S
Abstract  available in
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  1. The ornamental design for a semiconductor power package with three leads, as shown and described.

FIG. 1 is a perspective view of a semiconductor power package with three leads showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a right side elevational view thereof, the left side elevational view being a mirror image;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a front elevational view thereof.

Non-Patent Citations
1Ixys Corporation Product Catalog, p. 18, HiPerFET™ Power Mosfets.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD742842 *Sep 23, 2014Nov 10, 2015Lem Intellectual Property SaElectrical current transducer
U.S. ClassificationD13/182