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Publication numberUSD432097 S
Publication typeGrant
Application numberUS 29/117,450
Publication dateOct 17, 2000
Filing dateJan 24, 2000
Priority dateNov 20, 1999
Publication number117450, 29117450, US D432097 S, US D432097S, US-S-D432097, USD432097 S, USD432097S
InventorsYoung-hee Song, Hai-jeong Sohn, Se-Yong Oh, Jun-Young Jeon
Original AssigneeSamsung Electronics Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor package
US D432097 S
Abstract  available in
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  1. The ornamental design for a semiconductor package, as shown and described.

FIG. 1 is a perspective view showing our design;

FIG. 2 is a left-hand side view thereof, the right-hand side view being a mirror image thereof;

FIG. 3 is a front view thereof, the rear view being identical thereto;

FIG. 4 is a sectional view thereof;

FIG. 5 is a top view thereof; and,

FIG. 6 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US9497570Feb 6, 2015Nov 15, 2016Nimbelink Corp.Embedded wireless modem
USD731491 *Feb 7, 2014Jun 9, 2015NimbeLink L.L.C.Embedded cellular modem
U.S. ClassificationD13/182