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Publication numberUSD440582 S1
Publication typeGrant
Application numberUS 29/090,631
Publication dateApr 17, 2001
Filing dateJul 13, 1998
Priority dateMar 16, 1998
Publication number090631, 29090631, US D440582 S1, US D440582S1, US-S1-D440582, USD440582 S1, USD440582S1
InventorsPraburam Gopalraja, Zheng Xu, Michael Rosenstein, John C. Forster, Peijun Ding
Original AssigneeApplied Materials, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Sputtering chamber coil
US D440582 S1
Abstract  available in
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  1. The ornamental design for sputtering chamber coil, as shown and described.

FIG. 1 is a front elevational view;

FIG. 2 is a top view;

FIG. 3 is a right side elevational view;

FIG. 4 is a bottom view; and,

FIG. 5 is a rear elevational view of our sputtering chamber coil.

The left side elevation view (not shown) is the same as the right side elevational view (FIG. 3) because of coil symmetry.

Non-Patent Citations
1Applied Materials, Inc., Exhibit A, Dated prior to Jul. 13, 1998, the filing date of the present application.(Exhibit A is a drawing of a prior art coil design which is prior to the design of the present application).
2J. Hopwood et al., "Mechanisms for Highly Ionized Magnetron Sputtering," J. Appl. Phys., vol. 78, pp. 758-765, 1995.
3N. Jiwari et al., "Helicon wave plasma reactor employing single-loop antenna," J. of Vac. Sci. Technol., A 12(4), pp. 1322-1327, Jul./Aug. 1994.
4S.M. Rossnagel et al., "Magnetron Sputter Deposition with High Levels of Metal Ionization," Appl. Phys. Lett., vol. 63, pp. 3285-3287, 1993.
5S.M. Rossnagel, "Directional and Ionized Sputter Deposition for Microelectronics Applications," Proc. of 3rd ISSP (Tokyo), pp. 253-260, 1995.
6Search report in PCT/US98/10058 issued Nov. 4, 1998.
7U.S. application No. 08/559,345 filed Nov. 15, 1995.
8U.S. application No. 08/730,722 filed Oct. 8, 1996.
9U.S. application No. 08/856,335, filed May 14, 1997.
10U.S. application No. 08/857,719, filed May 16, 1997.
11U.S. application No. 08/857,944, filed May 16, 1997.
12U.S. application No. 09/039,695, filed Mar. 16, 1998.
13U.S. application No. 09/049,276 filed Mar. 27, 1998.
14U.S. application No. 09/064,355, filed Apr. 22, 1998.
15U.S. application No. 09/113,577, filed Jul. 10, 1998.
16U.S. application No. 29/090,618, filed Jul. 13, 1998.
17U.S. application No. 29/109,870.
18U.S. application No. 29/109,892.
19U.S. application No. 29/109,893.
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6660134 *Jul 10, 1998Dec 9, 2003Applied Materials, Inc.Feedthrough overlap coil
U.S. ClassificationD15/144.2