USD440582S1 - Sputtering chamber coil - Google Patents

Sputtering chamber coil Download PDF

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Publication number
USD440582S1
USD440582S1 US29/090,631 US9063198F USD440582S US D440582 S1 USD440582 S1 US D440582S1 US 9063198 F US9063198 F US 9063198F US D440582 S USD440582 S US D440582S
Authority
US
United States
Prior art keywords
sputtering chamber
chamber coil
coil
sputtering
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/090,631
Inventor
Praburam Gopalraja
Zheng Xu
Michael Rosenstein
John C. Forster
Peijun Ding
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/090,631 priority Critical patent/USD440582S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FORSTER, JOHN C., XU, ZHENG, DING, PEIJUN, GOPALRAJA, PRABURAM, ROSENSTEIN, MICHAEL
Application granted granted Critical
Publication of USD440582S1 publication Critical patent/USD440582S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevational view;
FIG. 2 is a top view;
FIG. 3 is a right side elevational view;
FIG. 4 is a bottom view; and,
FIG. 5 is a rear elevational view of our sputtering chamber coil.
The left side elevation view (not shown) is the same as the right side elevational view (FIG. 3) because of coil symmetry.

Claims (1)

  1. The ornamental design for sputtering chamber coil, as shown and described.
US29/090,631 1998-03-16 1998-07-13 Sputtering chamber coil Expired - Lifetime USD440582S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/090,631 USD440582S1 (en) 1998-03-16 1998-07-13 Sputtering chamber coil

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3969598 1998-03-16
US29/090,631 USD440582S1 (en) 1998-03-16 1998-07-13 Sputtering chamber coil

Publications (1)

Publication Number Publication Date
USD440582S1 true USD440582S1 (en) 2001-04-17

Family

ID=21906880

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/090,631 Expired - Lifetime USD440582S1 (en) 1998-03-16 1998-07-13 Sputtering chamber coil

Country Status (1)

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US (1) USD440582S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6660134B1 (en) * 1998-07-10 2003-12-09 Applied Materials, Inc. Feedthrough overlap coil

Non-Patent Citations (19)

* Cited by examiner, † Cited by third party
Title
Applied Materials, Inc., Exhibit A, Dated prior to Jul. 13, 1998, the filing date of the present application.(Exhibit A is a drawing of a prior art coil design which is prior to the design of the present application).
J. Hopwood et al., "Mechanisms for Highly Ionized Magnetron Sputtering," J. Appl. Phys., vol. 78, pp. 758-765, 1995.
N. Jiwari et al., "Helicon wave plasma reactor employing single-loop antenna," J. of Vac. Sci. Technol., A 12(4), pp. 1322-1327, Jul./Aug. 1994.
S.M. Rossnagel et al., "Magnetron Sputter Deposition with High Levels of Metal Ionization," Appl. Phys. Lett., vol. 63, pp. 3285-3287, 1993.
S.M. Rossnagel, "Directional and Ionized Sputter Deposition for Microelectronics Applications," Proc. of 3rd ISSP (Tokyo), pp. 253-260, 1995.
Search report in PCT/US98/10058 issued Nov. 4, 1998.
U.S. application No. 08/559,345 filed Nov. 15, 1995.
U.S. application No. 08/730,722 filed Oct. 8, 1996.
U.S. application No. 08/856,335, filed May 14, 1997.
U.S. application No. 08/857,719, filed May 16, 1997.
U.S. application No. 08/857,944, filed May 16, 1997.
U.S. application No. 09/039,695, filed Mar. 16, 1998.
U.S. application No. 09/049,276 filed Mar. 27, 1998.
U.S. application No. 09/064,355, filed Apr. 22, 1998.
U.S. application No. 09/113,577, filed Jul. 10, 1998.
U.S. application No. 29/090,618, filed Jul. 13, 1998.
U.S. application No. 29/109,870.
U.S. application No. 29/109,892.
U.S. application No. 29/109,893.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6660134B1 (en) * 1998-07-10 2003-12-09 Applied Materials, Inc. Feedthrough overlap coil

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