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Publication numberUSD444084 S1
Publication typeGrant
Application numberUS 29/120,011
Publication dateJun 26, 2001
Filing dateMar 13, 2000
Priority dateMar 13, 2000
Publication number120011, 29120011, US D444084 S1, US D444084S1, US-S1-D444084, USD444084 S1, USD444084S1
InventorsJerry L. Wrisley, James H. McGrath, Jr., David T. Engquist, Steve U. Reinhold
Original AssigneeTektronix, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Modular measurement instrument
US D444084 S1
Abstract  available in
Images(6)
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Claims(1)
  1. The ornamental design for a modular measurement instrument, as shown and described.
Description

The ornamental design disclosed in this application is for a modular measurement instrument having a display and processor module with raised bumper guards at the corners, a bi-level rear surface, an array of raised protrusions on the right and left sides of the display screen, an array of ribs formed on the left side of the instrument and extending onto the top and bottom surfaces with the top surface ribs terminating adjacent to the array of raised protrusions, and array of raised protrusions on the rear surface of the instrument adjacent to the ribs and a measurement module positioned on the lower surface of the bi-level rear surface such that the top surface of the measurement module is higher than the upper surface of the bi-level rear surface with the rear surface of the measurement module having an array of raised protrusions adjacent to the right side surface of the modular measurement instrument.

FIG. 1 is a perspective view of a modular measurement instrument;

FIG. 2 is a front elevation view of the modular measurement instrument;

FIG. 3 is a rear elevation view of the modular measurement instrument;

FIG. 4 is a left side elevation view of the modular measurement instrument;

FIG. 5 is a right side elevation view of the modular measurement instrument;

FIG. 6 is a top plan view of the modular measurement instrument; and,

FIG. 7 is a bottom plan view of the modular measurement instrument.

Classifications
U.S. ClassificationD10/78