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Publication numberUSD447120 S1
Publication typeGrant
Application numberUS 29/130,163
Publication dateAug 28, 2001
Filing dateSep 27, 2000
Priority dateSep 27, 2000
Publication number130163, 29130163, US D447120 S1, US D447120S1, US-S1-D447120, USD447120 S1, USD447120S1
InventorsKendrew Lee
Original AssigneeMonster Cable Products, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Molded cable interconnect
US D447120 S1
Images(5)
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Claims(1)
  1. The ornamental design for a molded cable interconnect, as shown and described.
Description

A portion of the disclosure of this design patent application document contains material to which a claim for copyright is also made. The copyright owner has no objection to the facsimile reproduction of this design patent application by anyone as it appears in the Patent and Trademark Office patent file or records, but reserves all other copyrights whatsoever.

FIG. 1 is a perspective view of a first embodiment of a molded cable interconnect, in accordance with the present invention.

FIG. 2 is a plan view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 3 is an underside view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 4 is a side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 5 is a corresponding side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1, as depicted in FIG. 1.

FIG. 6 is a rear view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 7 is a frontal view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 8 is a perspective view of a second embodiment of a molded cable interconnect, in accordance with the present invention.

FIG. 9 is a plan view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 10 is an underside view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 11 is a side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 12 is a corresponding side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 13 is a rear view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8; and,

FIG. 14 is a frontal view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

Classifications
U.S. ClassificationD13/146, D13/153