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Publication numberUSD449032 S1
Publication typeGrant
Application numberUS 29/119,093
Publication dateOct 9, 2001
Filing dateFeb 23, 2000
Priority dateFeb 23, 2000
Publication number119093, 29119093, US D449032 S1, US D449032S1, US-S1-D449032, USD449032 S1, USD449032S1
InventorsDavid Kiesekamp, Bevin Schmidt
Original AssigneeAlcatel Canada Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Faceplate for a circuit pack
US D449032 S1
Abstract  available in
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  1. The ornamental design of a faceplate for a circuit pack, as shown and described.

A portion of the disclosure of this patent document contains material to which a claim for copyright is made. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent file or records, but reserves all other copyright rights whatsoever.

FIG. 1 is a left elevational view of a first embodiment of the faceplate for a circuit pack;

FIG. 2 is a right elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top elevational view thereof, the bottom elevational view being a mirror view of said top elevational view;

FIG. 5 is a front elevational view thereof;

FIG. 6 is a front isometric view thereof; and,

FIG. 7 is a front isometric view of a second embodiment of the faceplate for a circuit pack, showing said design of FIGS. 1 to 7 when disposed in two sets at the front of a shelf for circuit packs.

The broken line showings of FIGS. 1 to 7 are for illustrative purposes only and form no part of the claimed design.

U.S. ClassificationD13/184, D13/177