US D449032 S1
Abstract available in
A portion of the disclosure of this patent document contains material to which a claim for copyright is made. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent file or records, but reserves all other copyright rights whatsoever.
FIG. 1 is a left elevational view of a first embodiment of the faceplate for a circuit pack;
FIG. 2 is a right elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top elevational view thereof, the bottom elevational view being a mirror view of said top elevational view;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a front isometric view thereof; and,
FIG. 7 is a front isometric view of a second embodiment of the faceplate for a circuit pack, showing said design of FIGS. 1 to 7 when disposed in two sets at the front of a shelf for circuit packs.
The broken line showings of FIGS. 1 to 7 are for illustrative purposes only and form no part of the claimed design.