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Publication numberUSD450070 S1
Publication typeGrant
Application numberUS 29/090,618
Publication dateNov 6, 2001
Filing dateJul 13, 1998
Priority dateJul 13, 1998
Publication number090618, 29090618, US D450070 S1, US D450070S1, US-S1-D450070, USD450070 S1, USD450070S1
InventorsPraburam Gopalraja, Zheng Xu, Michael Rosenstein, John C. Forster
Original AssigneeApplied Materials, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Sputtering chamber coil
US D450070 S1
Abstract  available in
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  1. The design for sputtering chamber coil, as shown and described.

FIG. 1 is a front elevational view;

FIG. 2 is a top view;

FIG. 3 is a right side elevational view;

FIG. 4 is a bottom view; and,

FIG. 5 is a rear elevational view of our sputtering chamber coil.

The left side elevation view (not shown) is the same as the right side elevational view (FIG. 3) because of coil symmetry.

Non-Patent Citations
1Applied Materials, Inc., Exhibit A, Dated Prior to Jul. 13, 1998, the filing date of the present application.(Exhibit A is a drawing of a prior art coil design which is prior to the design of the present application.).
2Search report in PCT/US98/10058 issued 4Nov98.
3U.S Patent Application Serial No. 08/559,345 filed Nov. 15, 1995 (Atty Dkt 938.X1/4479).
4U.S. Patent Application Serial No. 08/730,722 filed Oct. 8, 1996 (Atty Dkt 1207/4784).
5U.S. Patent Application Serial No. 09/049,276 Mar. 27, 1998 (Atty Dkt 938.D2/5703).
6U.S. Patent Application Serial No. 09/049,839 Mar. 27, 1998 (Atty Dkt 938.D1/5702).
7U.S. Patent Application Serial No. 29/109,870 (Atty. Dkt. 3980/PVD/DV).
8U.S. Patent Application Serial No. 29/109,892 (Atty. Dkt. 3979D/PVD/DV).
9U.S. Patent Application Serial No. 29/109,893 (Atty. Dkt. 3981/PVD/DV).
Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6660134 *Jul 10, 1998Dec 9, 2003Applied Materials, Inc.Feedthrough overlap coil
U.S. ClassificationD15/144.2