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Publication numberUSD453744 S1
Publication typeGrant
Application numberUS 29/141,773
Publication dateFeb 19, 2002
Filing dateMay 11, 2001
Priority dateMay 11, 2001
Publication number141773, 29141773, US D453744 S1, US D453744S1, US-S1-D453744, USD453744 S1, USD453744S1
InventorsCheng-Chi Lee, Xue Jin Fu, Xiang Bo Liu
Original AssigneeFoxconn Precision Components Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat sink
US D453744 S1
Abstract  available in
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  1. The ornamental design for a heat sink, as shown.

FIG. 1 is a perspective view of a heat sink of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
USD747278 *Sep 19, 2014Jan 12, 2016General Electric CompanyHeat sink
U.S. ClassificationD13/179