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Publication numberUSD457434 S1
Publication typeGrant
Application numberUS 29/136,212
Publication dateMay 21, 2002
Filing dateJan 26, 2001
Priority dateJan 26, 2001
Publication number136212, 29136212, US D457434 S1, US D457434S1, US-S1-D457434, USD457434 S1, USD457434S1
InventorsSwee Chuan Soh, Tee Hock Lim, Geap Wooi Goh, Shuib Bin Hassan
Original AssigneeTexchem-Pack (M) Sdn Bhd
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Tray for semiconductor packaging
US D457434 S1
Abstract  available in
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  1. The ornamental design for a tray for semiconductor packaging, as shown and described.

FIG. 1 is a top plan view of a tray for semiconductor packaging showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and,

FIG. 6 is a front elevational view thereof.

U.S. ClassificationD09/456