US D459705 S1
Abstract available in
FIG. 1 is a front, plan and right side perspective view of a semiconductor package showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.
The broken lines are shown in the views for illustrative purposes only and form no part of the claimed design.