Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD459705 S1
Publication typeGrant
Application numberUS 29/142,698
Publication dateJul 2, 2002
Filing dateJun 1, 2001
Priority dateMar 6, 2001
Publication number142698, 29142698, US D459705 S1, US D459705S1, US-S1-D459705, USD459705 S1, USD459705S1
InventorsYoshio Yokota, Nobuyuki Yokote
Original AssigneeShindengen Electric Manufacturing Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor package
US D459705 S1
Abstract  available in
Previous page
Next page
  1. The ornamental design for a semiconductor package, as shown and described.

FIG. 1 is a front, plan and right side perspective view of a semiconductor package showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a right side elevational view thereof.

The broken lines are shown in the views for illustrative purposes only and form no part of the claimed design.

Non-Patent Citations
1Japanese Design Application No. 929231, Publication Date: Jul. 6, 1995.
2Japanese Design Application No. 982886, Publication Date: Jun. 17, 1997.
3Japanese Design Application No. 982886—Similar 1, Publication Date: Jun. 24, 1997.
U.S. ClassificationD13/182