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Publication numberUSD461784 S1
Publication typeGrant
Application numberUS 29/145,234
Publication dateAug 20, 2002
Filing dateJul 17, 2001
Priority dateJul 17, 2001
Publication number145234, 29145234, US D461784 S1, US D461784S1, US-S1-D461784, USD461784 S1, USD461784S1
InventorsJames Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Surface mount package
US D461784 S1
Abstract  available in
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  1. The ornamental design for a surface mount package, as shown and described.

FIG. 1 is a perspective view of a surface mount package showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof:

FIG. 4 is a front elevational view thereof:

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 the right side elevational view thereof.

The broken line showing of the environment is for illustrative purpose only and forms not part of the claimed design.

Non-Patent Citations
1JEDEC Solid State Product Outline, Low Profile Small Outline J-Lead Package (LSOJ), PRSO-J/LSOJ, Issue B, Jun., 1999, MO-199, pp. 1-5.
2JEDEC Solid State Product Outlines, "Plastic Small Outline (SOJ) Package Family with .330 Inch Body Width", Issue B, May, 1992, MO-121, pp. 1-2.
3JEDEC Solid State Product Outlines, "Small Outline J-Lead" (SOJ) .300 Body Family (MS-013 Body), Issue A, Jun., 1988, MO-088, AA-AF.
U.S. ClassificationD13/182