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Publication numberUSD465207 S1
Publication typeGrant
Application numberUS 29/143,226
Publication dateNov 5, 2002
Filing dateJun 8, 2001
Priority dateJun 8, 2001
Publication number143226, 29143226, US D465207 S1, US D465207S1, US-S1-D465207, USD465207 S1, USD465207S1
InventorsRichard K. Williams, James Harnden, Anthony Chia, Chu Weibing
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Leadframe matrix for a surface mount package
US D465207 S1
Images(4)
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Claims(1)
  1. The ornamental design for leadframe matrix for a surface mount package, as shown and described.
Description

FIG. 1 is a top plan view of a portion of a leadframe matrix for a surface mount package showing my new design;

FIG. 2 is a top plan view of a single surface mount package shown at a lager scale for clarity of illustration; and,

FIG. 3 is a perspective view of FIG. 1.

The leadframe matrix for a surface mount package is shown broken away in FIGS. 1 and 3 of the drawing to indicate indeterminant length, it being understood that it has a uniform shape and appearance throughout its length.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6897486Nov 25, 2003May 24, 2005Ban P. LohLED package die having a small footprint
US7244965Oct 22, 2003Jul 17, 2007Cree Inc,Power surface mount light emitting die package
US7264378May 27, 2003Sep 4, 2007Cree, Inc.Power surface mount light emitting die package
US7280288Jun 4, 2004Oct 9, 2007Cree, Inc.Composite optical lens with an integrated reflector
US7456499Jun 4, 2004Nov 25, 2008Cree, Inc.Power light emitting die package with reflecting lens and the method of making the same
US7659551Mar 30, 2007Feb 9, 2010Cree, Inc.Power surface mount light emitting die package
US7692206Nov 25, 2003Apr 6, 2010Cree, Inc.Composite leadframe LED package and method of making the same
US7775685Feb 8, 2007Aug 17, 2010Cree, Inc.Power surface mount light emitting die package
US7777247Jan 14, 2005Aug 17, 2010Cree, Inc.Semiconductor light emitting device mounting substrates including a conductive lead extending therein
US7976186Aug 13, 2010Jul 12, 2011Cree, Inc.Power surface mount light emitting die package
US7980743Jun 14, 2005Jul 19, 2011Cree, Inc.LED backlighting for displays
US8167463Feb 8, 2011May 1, 2012Cree, Inc.Power surface mount light emitting die package
US8188488Mar 22, 2007May 29, 2012Cree, Inc.Power surface mount light emitting die package
US8308331Jul 1, 2011Nov 13, 2012Cree, Inc.LED backlighting for displays
US8446004Jun 26, 2008May 21, 2013Cree, Inc.Power light emitting die package with reflecting lens and the method of making the same
US8530915Feb 7, 2011Sep 10, 2013Cree, Inc.Power surface mount light emitting die package
US8608349Feb 8, 2011Dec 17, 2013Cree, Inc.Power surface mount light emitting die package
US8622582Feb 8, 2011Jan 7, 2014Cree, Inc.Power surface mount light emitting die package
US8710514May 25, 2012Apr 29, 2014Cree, Inc.Power surface mount light emitting die package
Classifications
U.S. ClassificationD13/182, D13/184