Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.

Patents

  1. Advanced Patent Search
Publication numberUSD465207 S1
Publication typeGrant
Application numberUS 29/143,226
Publication dateNov 5, 2002
Filing dateJun 8, 2001
Priority dateJun 8, 2001
Publication number143226, 29143226, US D465207 S1, US D465207S1, US-S1-D465207, USD465207 S1, USD465207S1
InventorsRichard K. Williams, James Harnden, Anthony Chia, Chu Weibing
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Leadframe matrix for a surface mount package
US D465207 S1
Abstract  available in
Images(4)
Previous page
Next page
Claims(1)
  1. The ornamental design for leadframe matrix for a surface mount package, as shown and described.
Description

FIG. 1 is a top plan view of a portion of a leadframe matrix for a surface mount package showing my new design;

FIG. 2 is a top plan view of a single surface mount package shown at a lager scale for clarity of illustration; and,

FIG. 3 is a perspective view of FIG. 1.

The leadframe matrix for a surface mount package is shown broken away in FIGS. 1 and 3 of the drawing to indicate indeterminant length, it being understood that it has a uniform shape and appearance throughout its length.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US6897486Nov 25, 2003May 24, 2005Ban P. LohLED package die having a small footprint
US7244965Oct 22, 2003Jul 17, 2007Cree Inc,Power surface mount light emitting die package
US7264378May 27, 2003Sep 4, 2007Cree, Inc.Power surface mount light emitting die package
US7280288Jun 4, 2004Oct 9, 2007Cree, Inc.Composite optical lens with an integrated reflector
US7456499Jun 4, 2004Nov 25, 2008Cree, Inc.Power light emitting die package with reflecting lens and the method of making the same
US7659551Feb 9, 2010Cree, Inc.Power surface mount light emitting die package
US7692206Nov 25, 2003Apr 6, 2010Cree, Inc.Composite leadframe LED package and method of making the same
US7775685Aug 17, 2010Cree, Inc.Power surface mount light emitting die package
US7777247Aug 17, 2010Cree, Inc.Semiconductor light emitting device mounting substrates including a conductive lead extending therein
US7976186Jul 12, 2011Cree, Inc.Power surface mount light emitting die package
US7980743Jun 14, 2005Jul 19, 2011Cree, Inc.LED backlighting for displays
US8167463May 1, 2012Cree, Inc.Power surface mount light emitting die package
US8188488May 29, 2012Cree, Inc.Power surface mount light emitting die package
US8308331Jul 1, 2011Nov 13, 2012Cree, Inc.LED backlighting for displays
US8446004May 21, 2013Cree, Inc.Power light emitting die package with reflecting lens and the method of making the same
US8530915Feb 7, 2011Sep 10, 2013Cree, Inc.Power surface mount light emitting die package
US8608349Feb 8, 2011Dec 17, 2013Cree, Inc.Power surface mount light emitting die package
US8622582Feb 8, 2011Jan 7, 2014Cree, Inc.Power surface mount light emitting die package
US8710514May 25, 2012Apr 29, 2014Cree, Inc.Power surface mount light emitting die package
US8932886May 20, 2013Jan 13, 2015Cree, Inc.Power light emitting die package with reflecting lens and the method of making the same
US20040041222 *May 27, 2003Mar 4, 2004Loh Ban P.Power surface mount light emitting die package
US20040079957 *Oct 22, 2003Apr 29, 2004Andrews Peter ScottPower surface mount light emitting die package
US20040124487 *Nov 25, 2003Jul 1, 2004Loh Ban P.LED package die having a small footprint
US20040126913 *Nov 25, 2003Jul 1, 2004Loh Ban P.Composite leadframe LED package and method of making the same
US20050269587 *Jun 4, 2004Dec 8, 2005Loh Ban PPower light emitting die package with reflecting lens and the method of making the same
US20050270666 *Jun 4, 2004Dec 8, 2005Loh Ban PComposite optical lens with an integrated reflector
US20060157726 *Jan 14, 2005Jul 20, 2006Loh Ban PSemiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US20070138497 *Feb 8, 2007Jun 21, 2007Loh Ban PPower surface mount light emitting die package
US20070181901 *Mar 30, 2007Aug 9, 2007Loh Ban PPower surface mount light emitting die package
US20100301372 *Aug 13, 2010Dec 2, 2010Cree, Inc.Power surface mount light emitting die package
Classifications
U.S. ClassificationD13/182, D13/184