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Publication numberUSD465223 S1
Publication typeGrant
Application numberUS 29/160,934
Publication dateNov 5, 2002
Filing dateMay 20, 2002
Priority dateMay 20, 2002
Publication number160934, 29160934, US D465223 S1, US D465223S1, US-S1-D465223, USD465223 S1, USD465223S1
InventorsHenry Milan
Original AssigneeHenry Milan
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Modular stackable component
US D465223 S1
Abstract  available in
Images(4)
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Claims(1)
  1. The ornamental design for a modular stackable component, as shown and described.
Description

FIG. 1 is a perspective view showing my new design for a modular stackable component.

FIG. 2 is a bottom plan view thereof.

FIG. 3 is a rear elevational view thereof.

FIG. 4 is a top plan view thereof.

FIG. 5 is a front elevational view thereof.

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a left side elevational view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7167372Aug 26, 2003Jan 23, 2007Belkin CorporationUniversal serial bus hub and method of manufacturing same
US7329152Aug 26, 2003Feb 12, 2008Belkin International, Inc.Universal serial bus hub and method of manufacturing same
US7381095Jun 20, 2005Jun 3, 2008Belkin International, Inc.Multi-standard connection hub and method of manufacturing same
US7806723Jan 4, 2008Oct 5, 2010Belkin International, Inc.Electrical grommet device
Classifications
U.S. ClassificationD14/434, D14/432