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Publication numberUSD465771 S1
Publication typeGrant
Application numberUS 29/145,512
Publication dateNov 19, 2002
Filing dateJul 24, 2001
Priority dateJul 24, 2001
Publication number145512, 29145512, US D465771 S1, US D465771S1, US-S1-D465771, USD465771 S1, USD465771S1
InventorsHsin-mao Hsieh
Original AssigneeHsieh Hsin-Mao
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Heat dissipating assembly
US D465771 S1
Abstract  available in
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  1. The ornamental design for a heat dissipating assembly, as shown.

FIG. 1 is a perspective view of a heat dissipating assembly, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

U.S. ClassificationD13/179