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Publication numberUSD466093 S1
Publication typeGrant
Application numberUS 29/145,536
Publication dateNov 26, 2002
Filing dateJul 26, 2001
Priority dateApr 27, 2001
Also published asUSD471167
Publication number145536, 29145536, US D466093 S1, US D466093S1, US-S1-D466093, USD466093 S1, USD466093S1
InventorsHitoshi Ebihara, Naoki Tomaru, Yoshiyuki Wasada, Tetsuya Ito, Hideki Kato, Tomohiro Igarashi, Hideki Yoda
Original AssigneeTaiyo Yuden Co., Ltd.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Hybird integrated circuit board
US D466093 S1
Abstract  available in
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  1. The ornamental design for a hybrid integrated circuit board, as shown and described.

FIG. 1 is a perspective view of a hybrid integrated circuit board showing an embodiment of our new design;

FIG. 2 is a front elevational view thereof, which is symmetrical to a rear elevational view not shown herein;

FIG. 3 is a left side elevational view thereof, which is symmetrical to a right side elevational view not shown herein;

FIG. 4 is a top plan view thereof; and,

FIG. 5 is a bottom plan view thereof.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US8113888Apr 29, 2009Feb 14, 2012Adc GmbhCircuit board for electrical connector and electrical connector
U.S. ClassificationD13/182