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Publication numberUSD466873 S1
Publication typeGrant
Application numberUS 29/151,024
Publication dateDec 10, 2002
Filing dateOct 31, 2001
Priority dateOct 31, 2001
Publication number151024, 29151024, US D466873 S1, US D466873S1, US-S1-D466873, USD466873 S1, USD466873S1
InventorsYehja Mohammed Kasem, Frank Kuo, Eddy Tjhia
Original AssigneeSiliconix Incorporated
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Semiconductor chip package
US D466873 S1
Images(9)
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Claims(1)
  1. The ornamental design for a semiconductor chip package, as shown and described.
Description

FIG. 1 is a perspective view from the left side and above the semiconductor chip package;

FIG. 2 is a perspective view from the left side and below the semiconductor chip package;

FIG. 3 is an elevational view from the left side of the semiconductor chip package;

FIG. 4 is an elevational view from the right side of the semiconductor chip package;

FIG. 5 is an elevational view from the back side of the semiconductor chip package;

FIG. 6 is an elevational view from the front side of the semiconductor chip package;

FIG. 7 is a top view of the semiconductor chip package; and,

FIG. 8 is a bottom view of the semiconductor chip package.

Referenced by
Citing PatentFiling datePublication dateApplicantTitle
US7608919Nov 15, 2006Oct 27, 2009University Of Notre Dame Du LacInterconnect packaging systems
US7612443Sep 3, 2004Nov 3, 2009University Of Notre Dame Du LacInter-chip communication
US8021965Nov 15, 2006Sep 20, 2011University Of Norte Dame Du LacInter-chip communication
US8623700Nov 15, 2006Jan 7, 2014University Of Notre Dame Du LacInter-chip communication
Classifications
U.S. ClassificationD13/182