Search Images Maps Play YouTube News Gmail Drive More »
Sign in
Screen reader users: click this link for accessible mode. Accessible mode has the same essential features but works better with your reader.


  1. Advanced Patent Search
Publication numberUSD467560 S1
Publication typeGrant
Application numberUS 29/145,233
Publication dateDec 24, 2002
Filing dateJul 17, 2001
Priority dateJul 17, 2001
Publication number145233, 29145233, US D467560 S1, US D467560S1, US-S1-D467560, USD467560 S1, USD467560S1
InventorsJames Harnden, Richard Williams, Anthony Chia, Chu Weibing
Original AssigneeGem Services, Inc.
Export CitationBiBTeX, EndNote, RefMan
External Links: USPTO, USPTO Assignment, Espacenet
Surface mount package
US D467560 S1
Abstract  available in
Previous page
Next page
  1. The ornamental design for a surface mount package, as shown and described.

FIG. 1 is a perspective view of a surface mount package showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 the right side elevational view thereof.

The broken line showing of the environment is for illustrative purpose only and forms not part of the claimed design.

Non-Patent Citations
1JEDEC Solid State Product Outline, Low Profile Small Outline J-Lead Package (LSOJ), PRSO-J/LSOJ, Issue B, Jun., 1999, MO-199, pp. 1-5.
2JEDEC Solid State Product Outlines, "Plastic Small Outline (SOJ) Package Family with .330 Inch Body Width", Issue B, May, 1992, MO-121, pp. 1-2.
3JEDEC Solid State Product Outlines, "Small Outline J-Lead" (SOJ) .300 Body Family (MS-013 Body), Issue A, Jun., 1988, MO-088, AA-AF.
U.S. ClassificationD13/182